LCI manufactures the fastest and most efficient production furnaces available for semiconductor packaging. High production yields and through put are achievable due to the design's quick start-up and changeover time, precise and repeatable temperature profiles up to 1000°C. The process gas atmosphere is uniform and ultra-clean. Click to view pdf with latest pictures.
The S-Series infrared furnaces achieve exacting temperature profiles with rapid heat rise and no overshoot. The rapid heat rise of these furnaces is of particular advantage in the final lid sealing or die attach process since the semiconductor is not exposed to prolonged high temperature. The systems require only minutes to come up to temperature and stabilize.
Computer Controlled. The furnace is operated via ProControl software installed on a robust managed platform RAID1 furnace computer. The process engineer can easily vary process parameters using the sophisticated PID and power control parameters in the software. An almost infinite number of recipes and profiles can be labeled and stored for ready access on the furnace computer. The software includes 2 levels of password protected control (Engineer and Operator) and logs each change in recipe load or furnace state useful for troubleshooting product and process performance.
The furnace software operates on a Microsoft Windows 7 Professional computer system. The program and all settings and recipes are stored on the RAID1 dual mirrored redundant hard drives. The computer is complete with 17" LCD 1280x1024 high resolution color graphic screen, full size keyboard/mouse interface and both Ethernet and wireless-N high-speed network connections to facilitate view and control of the furnace by managers and process engineers from any location. The furnace includes four (4) local USB ports (two at entrance and two on the LCD monitor at the control panel) for connecting profilers and jump drive storage devices.
Low cost of ownership results from the furnace versatility, high throughput, quick readiness, and low utility consumption. Small zones and high temperature differentials enable broad profile flexibility. Profiles with peak temperatures from 150°C to 1000°C are possible. The furnace can be turned on, turned off, or re-profiled in minutes, saving time and money.
|Process Gas||CDA, Nitrogen (-N), Forming Gas (-FG) and Nitrogen/Hydrogen mixing (-HO/HNM) models available.|
|Control Zones||6 zones||6-7 zones||8-zones||10-12 zones||16 zones|
|Heating Chamber length||152 cm (60 inches)||230 cm (90 inches)||304 cm (120 inches)||380 cm (150 inches)||609 cm (240 inches)|
|Cooling Chamber||152-304 cm (60-120 inches), consisting of a mix of these modules, depending on application:
1. CACT – CDA or N2 convective and radiant cooling, exterior fan heat removal.
2. CAWC – CDA or N2 convective and radiant cooling, cold water heat removal (city or chiller).
3. Fan-driven ambient air.
|Conveyor Belt||BNV- low mass, stabilized Nichrome-V|
|Belt Size (model, width)||S-609, 24 cm (9.5 in.)
S-615, 38 cm (15 in.)
S-624, 61 cm (24 in.)
|S-909, 24 cm (9.5 in.)
S-915, 38 cm (15 in.)
S-924, 61 cm (24 in.)
|S-1209, 24 cm (9.5 in.)
S-1215, 38 cm (15 in.)
S-1224, 61 cm (24 in.)
|S-1509, 24 cm (9.5 in.)
S-1515, 38 cm (15 in.)
S-1524, 61 cm (24 in.)
|S-2409, 24 cm (9.5 in.)
S-2415, 38 cm (15 in.)
S-2424, 61 cm (24 in.)
|Exhaust||Improved venturi exhaust stacks to reduce process gas consumption. Number of stacks vary with process requirements.|
|Temperature Capacity, max||600°C (1000°C with HT option)|
|Electrical||All models include universal transformers which accommodate 208-480 Vac and 50/60 Hz frequency anywhere in the world, allowing furnace relocation without external equipment. All furnace systems are phase balanced to improve facility efficiency. IR lamp controls automatically keep IR spectrum constant.|
Standard features are listed on the Standard Features pages (see link below). Popular options include the following:
|EM||Element Monitors||OA||Oxygen Analyzer||MA||Moisture Analyzer|
|OT||Overtemperature Monitor||SMEMA||Product Handling||HSK||Upstream/Downstream Handshake|
|LT||Process Ready Light Tower||UCD||Ultrasonic Cleaner Dryer||EH||Edge Heaters|